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Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet
Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet
Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet
Zhang, W.-l. (Autor:in) / Peng, B. (Autor:in) / Jiang, H.-c. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 36 ; 27-29
01.01.2003
3 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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