Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet: Fid-Bau Portal

Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet

Zhang, W.-l. / Peng, B. / Jiang, H.-c.

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Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet

Zhang, W.-l. / Peng, B. / Jiang, H.-c.

Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet

Zhang, W.-l. / Peng, B. / Jiang, H.-c.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electroless Ni-Cu-P Alloy Plating Technology for Bonded NdFeB Permanent Magnet

Contributors:

Zhang, W.-l. (author) / Peng, B. (author) / Jiang, H.-c. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 36 ; 27-29

Publication date:

2003-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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