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Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds
Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds
Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds
Kim, S. H. (Autor:in) / Kim, Y. W. (Autor:in) / Mitomo, M. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 38 ; 1117-1121
01.01.2003
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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