Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds: Fid-Bau Portal

Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds

Kim, S. H. / Kim, Y. W. / Mitomo, M.

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Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds

Kim, S. H. / Kim, Y. W. / Mitomo, M.

Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds

Kim, S. H. / Kim, Y. W. / Mitomo, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructure and fracture toughness of liquid-phase-sintered b-SiC containing b-SiC whiskers as seeds

Contributors:

Kim, S. H. (author) / Kim, Y. W. (author) / Mitomo, M. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 38 ; 1117-1121

Publication date:

2003-01-01

Size:

5 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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