Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructure-controlled interdiffusion of Cu/Co/Au thin films investigated by three-dimensional atom probe
Microstructure-controlled interdiffusion of Cu/Co/Au thin films investigated by three-dimensional atom probe
Microstructure-controlled interdiffusion of Cu/Co/Au thin films investigated by three-dimensional atom probe
Lang, C. (Autor:in) / Schmitz, G. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 353 ; 119-125
01.01.2003
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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