Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging
Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging
Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging
Jeong, S. W. (Autor:in) / Kim, J. H. (Autor:in) / Lee, H. M. (Autor:in)
MATERIALS SCIENCE FORUM ; 426/432 ; 4081-4086
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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