Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The effect of strain path and temperature on the microstructure developed in copper processed by ECAE
The effect of strain path and temperature on the microstructure developed in copper processed by ECAE
The effect of strain path and temperature on the microstructure developed in copper processed by ECAE
Huang, W. H. (Autor:in) / Yu, C. Y. (Autor:in) / Kao, P. W. (Autor:in) / Chang, C. P. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 366 ; 221-228
01.01.2004
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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