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Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy
Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy
Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy
Steinzig, M. (Autor:in) / Takahashi, T. (Autor:in)
EXPERIMENTAL TECHNIQUES ; 27 ; 59-63
01.01.2003
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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