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    Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy

    New search for: Steinzig, M.
    New search for: Takahashi, T.

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    Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy

    New search for: Steinzig, M.
    New search for: Takahashi, T.

    Access

    Access via TIB
    Check availability in my library
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    Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy

    New search for: Steinzig, M.
    New search for: Takahashi, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Technology Application Series: Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry - Part IV: Measurement Accuracy

    Contributors:

    Steinzig, M. (author) / Takahashi, T. (author)

    Published in:

    EXPERIMENTAL TECHNIQUES ; 27 ; 59-63

    Publication date:

    2003-01-01

    Size:

    5 pages

    ISSN:

    0732-8818

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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