Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Hoppe, M. (Autor:in) / Surbeck, G. (Autor:in) / Moret, H. (Autor:in) / Green, K. (Autor:in)
ADVANCING MICROELECTRONICS ; 31 ; 10-15
01.01.2004
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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