A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Hoppe, M. (author) / Surbeck, G. (author) / Moret, H. (author) / Green, K. (author)
ADVANCING MICROELECTRONICS ; 31 ; 10-15
2004-01-01
6 pages
Article (Journal)
English
DDC:
621.381
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