Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process
Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process
Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process
Shih, M.-S. (Autor:in) / Hourng, L.-W. (Autor:in) / Chang, C.-Y. (Autor:in)
JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 23 ; 651-680
01.01.2004
30 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1923
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