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Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process

Shih, M.-S. / Hourng, L.-W. / Chang, C.-Y.

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Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process

Shih, M.-S. / Hourng, L.-W. / Chang, C.-Y.

Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process

Shih, M.-S. / Hourng, L.-W. / Chang, C.-Y.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Random Walk Approach on the Study of Void Distribution During the Resin Transfer Molding Process

Contributors:

Shih, M.-S. (author) / Hourng, L.-W. (author) / Chang, C.-Y. (author)

Published in:

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 23 ; 651-680

Publication date:

2004-01-01

Size:

30 pages

ISSN:

0731-6844

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1923

Lee, D. H. / Lee, W. I. / Kang, M. K. | British Library Online Contents | 2006

Void Transport in Resin Transfer Molding

Kang, K. / Koelling, K. | British Library Online Contents | 2004

Influence From Process Parameters on Void Formation in Resin Transfer Molding

Lundstrom, T. S. / Gebart, B. R. | British Library Online Contents | 1994

Effect of Compression Process on Void Behavior in Structural Resin Transfer Molding

Hamada, H. / Ikegawa, N. / Maekawa, Z. et al. | British Library Conference Proceedings | 1995

Formation of microvoids during resin-transfer molding process

Kang, M. K. / Lee, W. I. / Hahn, H. T. | British Library Online Contents | 2000