Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Tensile fracture of tin-lead solder joints in copper
Tensile fracture of tin-lead solder joints in copper
Tensile fracture of tin-lead solder joints in copper
Prakash, K. H. (Autor:in) / Sritharan, T. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A. ; 379 ; 277-285
01.01.2004
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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