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Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Hasebe, N. (Autor:in) / Wang, X. (Autor:in) / Okumura, M. (Autor:in)
01.01.2004
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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