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Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Hasebe, N. (author) / Wang, X. (author) / Okumura, M. (author)
2004-01-01
12 pages
Article (Journal)
English
DDC:
620.118
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