Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Application of Additives in Copper Plating of Carbon Fiber
Application of Additives in Copper Plating of Carbon Fiber
Application of Additives in Copper Plating of Carbon Fiber
Yang, L.-w. (Autor:in) / Yao, G.-c. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 37 ; 32-33
01.01.2004
2 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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