Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Manuscript submission and processing: the new electronic pathway
Manuscript submission and processing: the new electronic pathway
Manuscript submission and processing: the new electronic pathway
Wegener, G. (Autor:in) / Kennedy, R. W. (Autor:in)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 38 ; 475-476
01.01.2004
2 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.12
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