A platform for research: civil engineering, architecture and urbanism
Manuscript submission and processing: the new electronic pathway
Manuscript submission and processing: the new electronic pathway
Manuscript submission and processing: the new electronic pathway
Wegener, G. (author) / Kennedy, R. W. (author)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 38 ; 475-476
2004-01-01
2 pages
Article (Journal)
English
DDC:
620.12
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