Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures: Fid-Bau Portal

Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

Hwang, S. J. / Koike, J. / Joo, Y. C.

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Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

Hwang, S. J. / Koike, J. / Joo, Y. C.

Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

Hwang, S. J. / Koike, J. / Joo, Y. C.

Zugriff

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Titel:

Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

Beteiligte:

Hwang, S. J. (Autor:in) / Koike, J. (Autor:in) / Joo, Y. C. (Autor:in)

Erschienen in:

MATERIALS SCIENCE FORUM ; 475/479 ; 3641-3646

Erscheinungsdatum:

01.01.2005

Format / Umfang:

6 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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