Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

    New search for: Hwang, S. J.
    New search for: Koike, J.
    New search for: Joo, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

    New search for: Hwang, S. J.
    New search for: Koike, J.
    New search for: Joo, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

    New search for: Hwang, S. J.
    New search for: Koike, J.
    New search for: Joo, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures

    Contributors:

    Hwang, S. J. (author) / Koike, J. (author) / Joo, Y. C. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 475/479 ; 3641-3646

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Effect of passivation on stress relaxation in electroplated copper films

    Gan, D. / Ho, P. S. / Pang, Y. et al. | British Library Online Contents | 2006

    Stress-relaxation behavior of fiber-reinforced polymer sheets at elevated temperatures

    Khaneghahi, Mohammad Houshmand / Ghamsari, Ali Kamyab / Ozbakkaloglu, Togay | Elsevier | 2021

    Stress behavior of electroplated Sn films during thermal cycling

    Shin, J.W. / Chason, E. | British Library Online Contents | 2009

    Residual Stress Relaxation and Cyclic Deformation Behavior of Deep Rolled AlMg4.5Mn (AA5083) at Elevated Temperatures

    Juijerm, P. / Altenberger, I. / Noster, U. et al. | British Library Online Contents | 2005

    Stress-Strain Relationships for Concrete at Elevated Temperatures

    Knaack, A. / Kurama, Y. / Kirkner, D. | British Library Conference Proceedings | 2009

    Back to top