Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Becker, G. (Autor:in) / Lee, C. (Autor:in) / Lin, Z. (Autor:in)
ADVANCED PACKAGING ; 14 ; 14-17
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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