A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Thermal Conductivity in Advanced Chips: Emerging Generation of Thermal Greases Offers Advantages
Becker, G. (author) / Lee, C. (author) / Lin, Z. (author)
ADVANCED PACKAGING ; 14 ; 14-17
2005-01-01
4 pages
Article (Journal)
English
DDC:
658.564
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