Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating: Fid-Bau Portal

Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

Feng, S.-b. / Shang, S.-b. / Feng, L.-t. / Bao, X. / Zhang, J.-w. / Li, Z.-h.

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Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

Feng, S.-b. / Shang, S.-b. / Feng, L.-t. / Bao, X. / Zhang, J.-w. / Li, Z.-h.

Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

Feng, S.-b. / Shang, S.-b. / Feng, L.-t. / Bao, X. / Zhang, J.-w. / Li, Z.-h.

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Zugriff über TIB

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Titel:

Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

Beteiligte:

Feng, S.-b. (Autor:in) / Shang, S.-b. (Autor:in) / Feng, L.-t. (Autor:in) / Bao, X. (Autor:in) / Zhang, J.-w. (Autor:in) / Li, Z.-h. (Autor:in)

Erschienen in:

MATERIALS PROTECTION -WUHAN- ; 38 ; 4-6

Erscheinungsdatum:

01.01.2005

Format / Umfang:

3 pages

ISSN:

1001-1560

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Unbekannt

Klassifikation:

DDC: 620.1

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