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    Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

    New search for: Feng, S.-b.
    New search for: Shang, S.-b.
    New search for: Feng, L.-t.
    New search for: Bao, X.
    New search for: Zhang, J.-w.
    New search for: Li, Z.-h.

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    Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

    New search for: Feng, S.-b.
    New search for: Shang, S.-b.
    New search for: Feng, L.-t.
    New search for: Bao, X.
    New search for: Zhang, J.-w.
    New search for: Li, Z.-h.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

    New search for: Feng, S.-b.
    New search for: Shang, S.-b.
    New search for: Feng, L.-t.
    New search for: Bao, X.
    New search for: Zhang, J.-w.
    New search for: Li, Z.-h.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

    Contributors:

    Feng, S.-b. (author) / Shang, S.-b. (author) / Feng, L.-t. (author) / Bao, X. (author) / Zhang, J.-w. (author) / Li, Z.-h. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 38 ; 4-6

    Publication date:

    2005-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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