Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electroforming of copper by the periodic reversal process
Electroforming of copper by the periodic reversal process
Electroforming of copper by the periodic reversal process
Sankar, P. R. (Autor:in) / Khattak, B. Q. (Autor:in) / Jain, A. K. (Autor:in) / Kaul, R. (Autor:in) / Ganesh, P. (Autor:in) / Nath, A. K. (Autor:in) / Tiwari, P. (Autor:in) / Amban, A. (Autor:in) / Pagare, A. (Autor:in)
SURFACE ENGINEERING -LONDON- ; 21 ; 204-208
01.01.2005
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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