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Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer
Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer
Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer
Chen, J.-s. (Autor:in) / Tian, Z.-j. (Autor:in) / Liu, Z.-d. (Autor:in) / Zhao, Y.-p. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -HANGZHOU- ; 29 ; 513-516
01.01.2011
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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