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Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength
Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength
Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength
Chen, X. (Autor:in) / Zhang, J. (Autor:in) / Jiao, C. (Autor:in) / Liu, Y. (Autor:in) / Kim, Y.-J. / Bae, D.-H.
01.01.2005
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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