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Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding
Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding
Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding
Zhang, J. (Autor:in) / Chen, X. (Autor:in) / Wei, X. L. (Autor:in) / Aliabadi, M. H. / Li, Q. / Li, L. / Buchholz, F.-G.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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