Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 19 ; 820-825
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Evaluation of fracture mechanic's parameters using electronic speckle pattern interferometry
British Library Online Contents | 1994
|Electronic Speckle Pattern Interferometry on a Microscopic Scale
British Library Online Contents | 1994
|Electronic speckle pattern interferometry for marble erosion measurements
British Library Conference Proceedings | 1992
|PIXEL QUALITY EVALUATION AND CORRECTION PROCEDURES IN ELECTRONIC SPECKLE PATTERN INTERFEROMETRY
British Library Online Contents | 2011
|Study of Steel Weldments Using Electronic Speckle Pattern Interferometry
British Library Online Contents | 1994
|