A platform for research: civil engineering, architecture and urbanism
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 19 ; 820-825
2005-01-01
6 pages
Article (Journal)
English
DDC:
621
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Evaluation of fracture mechanic's parameters using electronic speckle pattern interferometry
British Library Online Contents | 1994
|Electronic Speckle Pattern Interferometry on a Microscopic Scale
British Library Online Contents | 1994
|Electronic speckle pattern interferometry for marble erosion measurements
British Library Conference Proceedings | 1992
|PIXEL QUALITY EVALUATION AND CORRECTION PROCEDURES IN ELECTRONIC SPECKLE PATTERN INTERFEROMETRY
British Library Online Contents | 2011
|Recent developments and applications in electronic speckle pattern interferometry
British Library Online Contents | 1998
|