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Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding
Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding
Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding
Maeda, M. (Autor:in) / Tenyama, K. (Autor:in) / Shibayanagi, T. (Autor:in) / Naka, M. (Autor:in) / Naka, M. / Yamane, T.
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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