Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding: Fid-Bau Portal

Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding

Maeda, M. / Tenyama, K. / Shibayanagi, T. / Naka, M.

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Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding

Maeda, M. / Tenyama, K. / Shibayanagi, T. / Naka, M.

Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding

Maeda, M. / Tenyama, K. / Shibayanagi, T. / Naka, M.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding

Contributors:

Maeda, M. (author) / Tenyama, K. (author) / Shibayanagi, T. (author) / Naka, M. (author) / Naka, M. / Yamane, T.

Published in:

New Frontiers of Processing and Engineering in Advanced Materials ; 461-466

MATERIALS SCIENCE FORUM ; 502

Publication date:

2005-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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