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Three-Body Microcontact Model of Rough Surfaces and Its Application on Polishing of Wafer
Three-Body Microcontact Model of Rough Surfaces and Its Application on Polishing of Wafer
Three-Body Microcontact Model of Rough Surfaces and Its Application on Polishing of Wafer
Horng, J. H. (Autor:in) / Lee, J. S. (Autor:in) / Du, D. C. (Autor:in) / Jywe, W. / Chen, C.-L. / Fan, K.-C. / Fung, R. F. / Hanson, S. G. / Hsieh, W.-H. / Hsu, C.-L.
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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