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Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification
Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification
Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification
Mizutani, Y. (Autor:in) / Miwa, K. (Autor:in) / Tamura, T. (Autor:in) / Nakai, Y. (Autor:in) / Otsuka, Y. (Autor:in)
MATERIALS TRANSACTIONS ; 47 ; 1793-1797
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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