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    Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification

    New search for: Mizutani, Y.
    New search for: Miwa, K.
    New search for: Tamura, T.
    New search for: Nakai, Y.
    New search for: Otsuka, Y.

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    Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification

    New search for: Mizutani, Y.
    New search for: Miwa, K.
    New search for: Tamura, T.
    New search for: Nakai, Y.
    New search for: Otsuka, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification

    New search for: Mizutani, Y.
    New search for: Miwa, K.
    New search for: Tamura, T.
    New search for: Nakai, Y.
    New search for: Otsuka, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification

    Contributors:

    Mizutani, Y. (author) / Miwa, K. (author) / Tamura, T. (author) / Nakai, Y. (author) / Otsuka, Y. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 47 ; 1793-1797

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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