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Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder
Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder
Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder
Shen, J. (Autor:in) / Liu, Y. (Autor:in) / Yajing, H. (Autor:in) / Gao, H. (Autor:in)
RARE METALS -BEIJING- ENGLISH EDITION ; 25 ; 365-370
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
669
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