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    Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Yajing, H.
    New search for: Gao, H.

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    Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Yajing, H.
    New search for: Gao, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Yajing, H.
    New search for: Gao, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    Contributors:

    Shen, J. (author) / Liu, Y. (author) / Yajing, H. (author) / Gao, H. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 25 ; 365-370

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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