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Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Kim, H. S. (Autor:in) / Lee, D. G. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 67 ; 29-44
01.01.2007
16 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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