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Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry
Kim, H. S. (author) / Lee, D. G. (author)
COMPOSITES SCIENCE AND TECHNOLOGY ; 67 ; 29-44
2007-01-01
16 pages
Article (Journal)
English
DDC:
620.118
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