Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Measurement of deflections experienced by electronic chips during soldering
Measurement of deflections experienced by electronic chips during soldering
Measurement of deflections experienced by electronic chips during soldering
Sciammarella, C. A. (Autor:in) / Lamberti, L. (Autor:in) / Pappalettere, C. (Autor:in) / Volpicella, G. (Autor:in) / Sciammarella, F. M. (Autor:in)
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 41 ; 597-608
01.01.2006
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
624.176
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