A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Measurement of deflections experienced by electronic chips during soldering
Measurement of deflections experienced by electronic chips during soldering
Measurement of deflections experienced by electronic chips during soldering
Sciammarella, C. A. (author) / Lamberti, L. (author) / Pappalettere, C. (author) / Volpicella, G. (author) / Sciammarella, F. M. (author)
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 41 ; 597-608
2006-01-01
12 pages
Article (Journal)
English
DDC:
624.176
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