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Microstructural development and solidification cracking susceptibility of Cu deposits on steel: Part II—use of a Ni interlayer
Microstructural development and solidification cracking susceptibility of Cu deposits on steel: Part II—use of a Ni interlayer
Microstructural development and solidification cracking susceptibility of Cu deposits on steel: Part II—use of a Ni interlayer
Noecker, F. F. (Autor:in) / DuPont, J. N. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 42 ; 510-521
01.01.2007
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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