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Microstructure and Mechanical Properties of Copper Clad Aluminium Wire by Drawing at Room Temperature
Microstructure and Mechanical Properties of Copper Clad Aluminium Wire by Drawing at Room Temperature
Microstructure and Mechanical Properties of Copper Clad Aluminium Wire by Drawing at Room Temperature
Ma, Y. Q. (Autor:in) / Wu, Y. Z. (Autor:in) / Gao, H. T. (Autor:in) / Zhang, Y. (Autor:in) / Liu, S. Y. (Autor:in) / Kim, J. K. / Wo, D. Z. / Zhou, L. M. / Huang, H. T. / Lau, K. T.
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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