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Change in microstructures and mechanical properties during deep wire drawing of copper
Change in microstructures and mechanical properties during deep wire drawing of copper
Change in microstructures and mechanical properties during deep wire drawing of copper
Hanazaki, K. (Autor:in) / Shigeiri, N. (Autor:in) / Tsuji, N. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 5699-5707
01.01.2010
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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