Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of impurities on the recrystallization texture in commercially pure copper-ETP wires
Effect of impurities on the recrystallization texture in commercially pure copper-ETP wires
Effect of impurities on the recrystallization texture in commercially pure copper-ETP wires
Jakani, S. (Autor:in) / Baudin, T. (Autor:in) / de Novion, C. H. (Autor:in) / Mathon, M. H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 456 ; 261-269
01.01.2007
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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