Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood
Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood
Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood
Jiang, H. (Autor:in) / Kamdem, D. P. (Autor:in)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 41 ; 637-644
01.01.2007
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.12
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