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    Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

    New search for: Jiang, H.
    New search for: Kamdem, D. P.

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    Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

    New search for: Jiang, H.
    New search for: Kamdem, D. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

    New search for: Jiang, H.
    New search for: Kamdem, D. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

    Contributors:

    Jiang, H. (author) / Kamdem, D. P. (author)

    Published in:

    WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 41 ; 637-644

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    0043-7719

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.12

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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