Thermal Stress Distribution in the Corner of IC Package Structure

Li, H.P. (Autor:in) / Shi, R. (Autor:in) / He, Y.T. (Autor:in) / Zhang, H.X. (Autor:in) / Li, F. (Autor:in) / Zhou, Y. / Tu, S.-T. / Xie, X.

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2900-2903

KEY ENGINEERING MATERIALS ; 353/358

01.01.2007

4 pages

1013-9826

Aufsatz (Zeitschrift)

Print

Englisch

DDC:  620.11