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    Thermal Stress Distribution in the Corner of IC Package Structure

    New search for: Li, H.P.
    New search for: Shi, R.
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    New search for: Zhang, H.X.
    New search for: Li, F.
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    New search for: Tu, S.-T.
    New search for: Xie, X.

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    Thermal Stress Distribution in the Corner of IC Package Structure

    New search for: Li, H.P.
    New search for: Shi, R.
    New search for: He, Y.T.
    New search for: Zhang, H.X.
    New search for: Li, F.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal Stress Distribution in the Corner of IC Package Structure

    New search for: Li, H.P.
    New search for: Shi, R.
    New search for: He, Y.T.
    New search for: Zhang, H.X.
    New search for: Li, F.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Thermal Stress Distribution in the Corner of IC Package Structure

    Contributors:

    Li, H.P. (author) / Shi, R. (author) / He, Y.T. (author) / Zhang, H.X. (author) / Li, F. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

    Published in:

    Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2900-2903

    KEY ENGINEERING MATERIALS ; 353/358

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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